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HUWAEI (HW1) AMAOE STENCIL
Size Guides
SIZE GUIDE
Mobile tolls & parts
Delivery and return
Delivery and return
Shipping Information
Shipping Information
Composition and care
Composition and care
Description
The Amaoe HW1 BGA reballing stencil is designed for repairing Huawei CPU and RAM components. Here are the details for the HW1 stencil:
- Compatibility: Kirin 930/935 HI3630/3635 CPU, used in devices like Huawei P8, Mate7/MTS, Honor 7/X2, and more.
- Purpose: It facilitates precise soldering during reballing, ensuring proper connections for CPU and RAM components.
- Thickness: The stencil is 0.12mm thick, allowing accurate application of solder paste.
- Application: Ideal for soldering repair work on Huawei devices.
